TSMC announced its superiority over Intel: What will the new processors from Taiwan be like?

Taiwanese company TSMC, one of the world’s largest processor developers, announced that its next chips will use advanced N3P node technology, which could outperform Intel’s 20A and 18A technology nodes, which are planned to appear in 2024. This was reported by the TechSpot portal.

The N3P process node is a semiconductor manufacturing process developed by TSMC. It has a transistor size of 3 nanometers, which means N3P transistors can be more energy efficient and performant. Compared to today’s N3 technology node, the company touts up to 5% improved performance on the N3P, up to a 10% reduction in power consumption at the same clock speeds, and a 4% increase in transistor density for mixed chip designs.

N3P technology will be used in a wide range of products, from smartphones to tablets, laptops, servers and automotive chips. N3P will use EUV (13.5 nanometer ultraviolet) technology for all layers except metallization. This makes it possible to reduce the size of transistors and increase packaging density. N3P will also enable the use of new pad technology that will increase packaging density and reduce resistance.

During a recent earnings call, TSMC CEO Jeff Su stated that its internal evaluations confirm improvements in N3P technology. TSMC’s 3nm-class production node demonstrated a “comparable PPA” (power performance area) to the Intel 18A node. N3P is expected to be even better, coming to market earlier, having “higher technological maturity” and offering significant cost advantages.

TSMC CEO also stated that the company’s 2nm technology, although still in development, is expected to surpass both N3P and 18A. TSMC’s 2nm manufacturing process could be the most advanced technology in the semiconductor industry when it launches in 2025.

Intel, for its part, says its 20A and Intel 18A process nodes are based on gate all-field-effect transistors (GAAFETs), which is a common practice for all companies developing process nodes where the transistor gate pitch is less than 3nm. . Another advantage of Intel’s new technology is rear power distribution (called PowerVia). At least in theory, this should allow for higher logic densities, higher clock speeds, and lower power consumption, leading to more energy-efficient designs.

Previously Focus He said Huawei was accused of stealing ASML secrets. ASML CEO Peter Wennink says the stolen information is crucial but not enough to understand the full picture of production.